Photo-Resist Board 233 x 220mm

Suitable for normal industrial and professional applications. Base laminate conforms to all international standards and releases, as lisited in IPC4101A. RoHS compliant. Specifications Thickness: 1.6mm Copper foil: 35 micron Dissipation factor: 35 Dielectric constant: 5.4 Solderbath resistance (260°C): 20 secs Resist thickness: 5 microns Spectral response: 350-450nm, typical 2-3 minute exposure UV light energy required: Approx. 50mJ/cm Shelf life: 1 year at 15-20°C